★AdvisorsIEEE/CEDA, ACM/SIGDADepartment of Information Science, National Natural Science Foundation of China (NSFC)Chinese Institute of Electronics (CIE)Steering Committee, Major Plan of “Fundamental Research on Post-Moore Novel Devices”
★OrganizerEDA Ecosystem Development Accelerator (EDA²)EDA Committee of CIE
★Co-OrganizersXidian UniversityPeking UniversitySoutheast UniversityTsinghua University
★Committees-Executive Committee-General Chairs：Ru Huang，President of Southeast University & Academician of the Chinese Academy of SciencesYue Hao，Professor of Xidian University & Academician of the Chinese Academy of Sciences
-Steering Committee-Shaojun Wei, Tsinghua UniversityXuan Zeng, Fudan UniversityPatrick Girard, French National Center for Scientific Research
-Technical Program Committee-Conference Chairs：Zhangming Zhu, Xidian UniversityRunsheng Wang, Peking UniversityJun Yang, Southeast University
Technical Program Chairs：Hailong You, Xidian UniversityYun Liang, Peking UniversityHao Yan, Southeast University
Special Session ChairWenjian Yu, Tsinghua University
Industrial Session Chair:Fan Yang , Shenzhen GWX Technology Co.,Ltd.
Tutorial/Training Chair:Zuochang Ye, Tsinghua University
Finance Chair:Gang Chen, Nanjing Industrial Innovation Center of EDA
Keynote Speaker Chair:Wanli Chang, University of York
Panel Chair:Yibo Lin, Peking University
Local Arrangements Chair:Xiaoning He, Shaanxi Province Semiconductor Association
Session Chair:Cheng Zhuo, Zhejiang University
Publication Chair:Qiang Xu, The Chinese University of Hong Kong
Industry Liaison:Yutao Ma, Primarius Technologies Co.,Ltd
Exhibition Chair:Megy Wang, Giga Design Automation Limited
Publicity Chair:Xin Li, Duke Kunshan University
Outreach Chair – US:Hai Zhou, Northwestern University
Outreach Chair – Canada;Peter Chun, University of Alberta
Outreach Chair – Europe:Zebo Peng, Linköping University
Outreach Chair – Asia;Xiaoqing Wen, Kyushu Institute of Technology
★Track Committee
1. Technology & ModelChair:Xingsheng Wang, Huazhong University of Science and TechnologyCo-Chair:Lining Zhang, Peking University
2. Analog Circuit EDAChair:Fan Yang, Fudan UniversityCo-Chair:Hao Yu, Southern University of Science and Technology
3. Digital Design & VerificationChair: Zhufei Chu, Ningbo UniversityCo-Chair: Yong Fu, XEPIC Corporation Limited
4. Physical ImplementationChair: Hailong Yao, University of Science and Technology BeijingCo-Chair: Peng Cao, Southeast University
5. Wafer ManufacturingChair: Lan Chen, Institute of Microelectronics of The CASCo-Chair: Yayi Wei, Institute of Microelectronics of The CAS
6. Packaging & Multi-PhysicsChair: Hongliang Lu, Xidian UniversityCo-Chair: Min Tang, Shanghai Jiao Tong University
7.Emerging TechnologyChair: Bei Yu, The Chinese University of Hong KongCo-Chair: Li Jiang, Shanghai Jiao Tong University
8. EDA Foundation & StandardsChair: Xiaohui Tan, Nanjing Industrial Innovation Center of EDACo-Chair: Duanduan Jian, China Electronics Standardization Institute
8. Open Source EDAChair: Huawei LiCo-chair: Guojie Luo
8. EDA ContestChair: Longxing Shi, Southeast UniversityEDA Contest Co-Chair: Zhixiong Di, Southwest Jiaotong University
★Call for Papers
Original papers in, but not limited to, the following areas are invited:[1] Technology & Model1.1 Device Compact Modeling1.2 Process Design Kit1.3 Semiconductor Process & Device Simulation1.4 Cell Library Design, Characterization and Verification
[2]Analog Circuit EDA2.1 Schematic & Layout Design2.2 Circuit Simulation2.3 On-chip & Packaging Electromagnetic Field Simulation2.4 Radio-Frequency & Photoelectric Compound Circuit Simulation
[3]Digital Design & Verification3.1 Digital Simulation / Emulation3.2 High-Level Synthesis3.3 Logic Synthesis3.4 Formal Verification3.5 Constructing Hardware in Scala Embedded Language
[4]Physical Implementation4.1 Design-For-Test, Design-For-Reliability, Design-For-Manufacturability4.2 Placement & Routing4.3 Parasitic Extraction4.4 Timing Analysis4.5 Physical Verification4.6 Electromigration & IR drop
[5]Wafer Manufacturing5.1 Computational Lithography5.2 Masking Manufacturing5.3 Yield & Defect Analysis5.4 Process Modeling and Emulation5.5 Metrology and Silicon Data Processing5.6 APC (Automatic Process Control) Technology
[6]Packaging & Multi-Physics6.1 Packaging Design6.2 Chip Level Thermal Simulation6.3 Packaging Stress Analysis6.4 Multi-Physics Simulation
[7]Emerging Technologies7.1 Artificial Intelligence for EDA7.2 Cloud / Parallel Computing for EDA7.3 Heterogeneous Computing for EDA
[8]Miscellaneous8.1 Open Source EDA8.2 EDA Database8.3 EDA Standardization
Authors are invited to submit original papers, which have not been published elsewhere and are not currently under consideration for another journal, conference or workshop. Research findings can be submitted as full papers. All paper submissions must be done electronically using the submission system.
Best Paper Award, Honorable Mention Paper Award will be selected after the presentations.Invited Talks: Need an abstract within one pageExtended Abstract: 1-2 pagesRegular Paper: 4-6 pagesNote: Extended abstract will not be published. If you have the publication purpose, please submit full paper before the deadline.
★Paper TemplateTemplates could be downloaded from below or you can find them at the IEEE website: https://www.ieee.org/conferences/publishing/templates.html
★Submission Link: https://www.eda2.com/conferenceHome/submissionHome
★LiaisonIEEE/CEDA Representative: Tsung-Yi HoCIE Representative: Shouyi YinWebsite Chair: Huixin TangSecretary: Xiakai Wang
★Contact Us
Conference Secretary: Ms. Joyce Zhong
Phone: +86 186 2826 3876
Email: iseda@eda2.comYu Huang | huangyu61@hisilicon.com
