2018 International Conference on Smart Materials Analysis (ICSMA 2018)--EI Compendex, Scopus
January 26-28, 2018
Singapore
http://www.icsma.org/index.html
Dear Scholars and Researchers,
Warmest Greetings from ICSMA 2018!
This is 2018 International Conference on Smart Materials Analysis (ICSMA 2018) conference
committee. We are very pleased to tell you that ICSMA 2018 will be held in Singapore
during January 26-28, 2018.
ICSMA provides a forum for accessing to the most up-to-date and authoritative knowledge
from both industrial and academic worlds, sharing best practice in the field of smart
materials Analysis. The meeting will provide an opportunity to highlight recent
developments and to identify emerging and future areas of growth in this exciting field.
Publication
All submissions will be peer reviewed.
All the registered and presented papers will be accepted by conference proceedings and
published in IOP Conference Series: Materials Science and Engineering (Online ISSN: 1757
899X; Print ISSN: 1757-8981).
Indexed by: EI Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al.
Submission
ICSMA 2018 is now accepting manuscript submissions.
Please submit your full paper to us: icsma@saise.org
Conference Schedule
January 26th, 2018: 10:00-16:00 Registration,collecting conference materials
January 27th, 2018: 09:00-12:00 Opening Remarks & Keynote Speeches
13:30-18:00 Oral & Poster Sessions
January 28th, 2018: 10:00-16:00 Visit / Tour (Pending)
Contact us
Ms. Connie Young
Tel: +1-302-444-8432 (USA)/ +86-18062000004 (China)
Email: icsma@saise.org
Website：http://www.icsma.org/index.html
