★Co-Sponsored by:
==Southeast University, China
==University of Electronic Science and Technology of China, China
==Wuhan University of Technology, China
==Submission==
1. Full paper (publication and presentation)
2. Abstract (presentation only)**Electronic submission system: https://easychair.org/conferences/?conf=icicm2024**
Email submission: icicm_conf@vip.163.com
More detail about submission, please visit at http://icicm.net/submission.html
=Publication=
The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc.***ICICM2016-2023 has been successfully indexed by EI Compendex and Scopus already!
=Topics (include but not limit)=
► Devices and Circuits for Wirless System► Application Specific Circuits and Systems for Communication► Digital, Analog, Mixed Signal IC and SOC design technology► Silicon integrated circuits and manufacturing► Low-power, RF devices & circuits► IC Computer-Aided –Design technology, DFM► Silicon/germanium devices and device physics► Interconnect, Low K, High K and other process technologies► Unconventional and nano-electronics► Organic semiconductor devices and technologies ► Compound semiconductor devices and circuits► Displays, sensors and MEMS ► Semiconductor materials and material characterization► Packaging and testing technology ► Solar cell & other devices for new energy sources► Modeling and simulation ► Equipment technology► Reliability ► Displays, sensors and MEMS► Advance memories technologyFor more topics, please visit at: http://icicm.net/call-for-papers.html
==Organizing Committee==
**Advisory ChairsPui-in Mak, University of Macau, Macau, ChinaLjiljana Trajkovic, Simon Fraser University, Canada
**Conference ChairsZhigong Wang, Southeast University, ChinaChen Liu, Nanjing University of Posts and Telecommunica
